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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
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61540e188b36fa1ee7c83e68 Multilayer Ceramic Capacitors MLCC - SMD/SMT 100V 6.6uF X7R 1812 10% AEC-Q200 https://cdn1.storehippo.com/s/59c9e4669bd3e7c70c5f5e6c/61540e188b36fa1ee7c83e6a/webp/c1108_dual_stack_dsl.png

KONNEKT™ High-Density Packaging Technology

KEMET Electronics KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.

TT-MU-80-C1812C665K1RLAUTO
in stock INR 614
KEMET
1 1

Multilayer Ceramic Capacitors MLCC - SMD/SMT 100V 6.6uF X7R 1812 10% AEC-Q200

Sku: TT-MU-80-C1812C665K1RLAUTO
₹614


Sold By: tenettech
Features
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Description of product

KONNEKT™ High-Density Packaging Technology

KEMET Electronics KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.