SHOP FOR
http://base-store.storehippo.com/
# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. 560104 Bangalore IN
Tenettech E-Store
# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://cdn1.storehippo.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/webp/59dafe26aef6e1d20402c4c3-480x480.png" info@tenettech.com
61540f24f42c3b1d25c4d0ae Multilayer Ceramic Capacitors MLCC - SMD/SMT 250V 0.94uF X7R 1812 10% AEC-Q200 https://cdn1.storehippo.com/s/59c9e4669bd3e7c70c5f5e6c/61540f24f42c3b1d25c4d0b0/webp/c1108_dual_stack_dsl.png

KONNEKT™ High-Density Packaging Technology

KEMET Electronics KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.

TT-MU-80-C1812C944KARLAUTO
in stock INR 461
KEMET
1 1

Multilayer Ceramic Capacitors MLCC - SMD/SMT 250V 0.94uF X7R 1812 10% AEC-Q200

Sku: TT-MU-80-C1812C944KARLAUTO
₹461


Sold By: tenettech
Features
  • Shipping in 10-12 Working Days

Description of product

KONNEKT™ High-Density Packaging Technology

KEMET Electronics KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.