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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
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61540f3ed1431e1deb1c0c8a Multilayer Ceramic Capacitors MLCC - SMD/SMT 2kV 0.044uF X7R 2220 10% https://cdn1.storehippo.com/s/59c9e4669bd3e7c70c5f5e6c/61540f3ed1431e1deb1c0c8c/webp/c1108_dual_stack_dsl.png

KONNEKT™ High-Density Packaging Technology

KEMET Electronics KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.

TT-MU-80-C2220C443KGRLAUTO
in stock INR 530
KEMET
1 1

Multilayer Ceramic Capacitors MLCC - SMD/SMT 2kV 0.044uF X7R 2220 10%

Sku: TT-MU-80-C2220C443KGRLAUTO
₹530


Sold By: tenettech
Features
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Description of product

KONNEKT™ High-Density Packaging Technology

KEMET Electronics KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.