HSB37-404023-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 40 X 40 X 23 MM

Images for reference only.

Specifications: 

1. Type: Top Mount
2. Package Cooled: BGA
3. Attachment Method: Adhesive (Not Included)
4. Shape: Square, Pin Fins
5. Length: 1.575″ (40.00mm)
6. Width: 1.575″ (40.00mm)
7. Diameter –
8. Fin Height: 0.905″ (23.00mm)
9. Power Dissipation @ Temperature Rise: 11.7W @ 75°C
10. Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM
11. Thermal Resistance @ Natural: 6.43°C/W

For more detail refer to the datasheet in Attachments. 

Package Includes:

1 x HSB37-404023-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 40 X 40 X 23 MM