WAFER-XH2.54-2PWZ-R62-XUNPU-1x2P XH 2P Tin 2 -25℃~+85℃ 3A 1 2.5mm Copper alloy Bend-in Push-Pull,P=2.54mm Wire To Board Connector ROHS.

Note: Images for reference only.

Specifications:

Manufacturer: XUNPU
Package: Push-Pull,P=2.54mm
Y-Width of Bottom Edge on Board: 7.17mm
Pins Structure: 1x2P
Reference Series: XH
Number of Pins: 2P
Contact Plating: Tin
Row Spacing: –
Number of PINs Per Row: 2
Operating Temperature: -25℃~+85℃
Current Rating: 3A
Plastic Material: PA66
Color: Red
Number of Rows: 1
Supplementary Features: –
Flame Retardant Rating: UL94V-2
Pitch: 2.5mm
Voltage Rating: 250V
Contact Material: Copper alloy
X-Length of Bottom Edge on Board (Spacing Line): 7.5mm
Z-Height of the Board: 5.75mm
Mounting Type: Right-Angle

For detailed specifications, please refer to datasheet in Attachments.

Package Includes:

1 x WAFER-XH2.54-2PWZ-R62-XUNPU-1x2P XH 2P Tin 2 -25℃~+85℃ 3A 1 2.5mm Copper alloy Bend-in Push-Pull,P=2.54mm Wire To Board Connector ROHS