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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.componentstores.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1e4c50eccc002b17883d CUI Devices 2223-HSB01-080808-ND https://www.componentstores.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1e4d50eccc002b178841/mfg_hsb01-080808.jpg

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive (Not Included)
Shape Square, Pin Fins
Length 0.335" (8.50mm)
Width 0.335" (8.50mm)
Diameter -
Fin Height 0.315" (8.00mm)
Power Dissipation @ Temperature Rise 1.9W @ 75°C
Thermal Resistance @ Forced Air Flow 16.00°C/W @ 200 LFM
Thermal Resistance @ Natural 39.10°C/W
Material Aluminum Alloy
Material Finish Black Anodized
TT-DKEY-2223-HSB01-080808-ND
in stock INR 105.11999999999999
CUI Devices
1 1
CUI Devices 2223-HSB01-080808-ND

CUI Devices 2223-HSB01-080808-ND

Sku: TT-DKEY-2223-HSB01-080808-ND
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₹105.12
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Sold By: tenettech
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Description of product

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive (Not Included)
Shape Square, Pin Fins
Length 0.335" (8.50mm)
Width 0.335" (8.50mm)
Diameter -
Fin Height 0.315" (8.00mm)
Power Dissipation @ Temperature Rise 1.9W @ 75°C
Thermal Resistance @ Forced Air Flow 16.00°C/W @ 200 LFM
Thermal Resistance @ Natural 39.10°C/W
Material Aluminum Alloy
Material Finish Black Anodized

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