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Tenettech E-Store
# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.componentstores.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1e508725dd0036abee0a CUI Devices 2223-HSB04-171706-ND https://www.componentstores.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1e518725dd0036abee0d/mfg_hsb04-171706.jpg

HEAT SINK, BGA, 17 X 17 X 6 MM

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive (Not Included)
Shape Square, Pin Fins
Length 0.669" (17.00mm)
Width 0.669" (17.00mm)
Diameter -
Fin Height 0.236" (6.00mm)
Power Dissipation @ Temperature Rise 2.5W @ 75°C
Thermal Resistance @ Forced Air Flow 13.10°C/W @ 200 LFM
Thermal Resistance @ Natural 29.73°C/W
Material Aluminum Alloy
Material Finish Black Anodized
TT-DKEY-2223-HSB04-171706-ND
in stock INR 116.64
CUI Devices
1 1

CUI Devices 2223-HSB04-171706-ND

Sku: TT-DKEY-2223-HSB04-171706-ND
₹116.64


Sold By: tenettech
Features
  • Shipping in 10-12 Working Days

Description of product

HEAT SINK, BGA, 17 X 17 X 6 MM

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive (Not Included)
Shape Square, Pin Fins
Length 0.669" (17.00mm)
Width 0.669" (17.00mm)
Diameter -
Fin Height 0.236" (6.00mm)
Power Dissipation @ Temperature Rise 2.5W @ 75°C
Thermal Resistance @ Forced Air Flow 13.10°C/W @ 200 LFM
Thermal Resistance @ Natural 29.73°C/W
Material Aluminum Alloy
Material Finish Black Anodized