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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. 560104 Bangalore IN
Tenettech E-Store
# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.componentstores.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1d70dfbbd30024c24e46 Boyd Laconia, LLC HS522-ND https://www.componentstores.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1d71dfbbd30024c24e4f/374324b60023g.jpg

BGA HEAT SINK

Product Attributes:

Series 37432
Product Status Active
Type Board Level
Package Cooled BGA, FPGA
Attachment Method Solder Anchor
Shape Square, Pin Fins
Length 1.063" (27.00mm)
Width 1.063" (27.00mm)
Diameter -
Fin Height 0.394" (10.00mm)
Power Dissipation @ Temperature Rise 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural 30.60°C/W
Material Aluminum
Material Finish Black Anodized
TT-DKEY-HS522-ND
in stock INR 371.52
Boyd Laconia, LLC
1 1
Boyd Laconia, LLC HS522-ND

Boyd Laconia, LLC HS522-ND

Sku: TT-DKEY-HS522-ND
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₹371.52
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Description of product

BGA HEAT SINK

Product Attributes:

Series 37432
Product Status Active
Type Board Level
Package Cooled BGA, FPGA
Attachment Method Solder Anchor
Shape Square, Pin Fins
Length 1.063" (27.00mm)
Width 1.063" (27.00mm)
Diameter -
Fin Height 0.394" (10.00mm)
Power Dissipation @ Temperature Rise 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural 30.60°C/W
Material Aluminum
Material Finish Black Anodized

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